Si3N4 powder is also known as silicon nitride. Silicon nitride has super-hard properties and is resistant both to wear and high temperature oxidation.
Purity: 99%

Particle Size: 0.25um-1.53um


Silicon Nitride Powder Si3N4


The

silicon nitride composition

It is made of silicon and nitrogen. Si3n4 in silicon nitride has the highest thermodynamic stability. It is a solid white color with high melting points, chemical inertity, and is diluted HF, hot H2SO4 or hot HF. It is extremely hard, 8.5 on Mohs scale. This makes it very stable and thermally stable.


Silicon nitride

An inorganic substance is one that can be found in the

silicon nitride formula

It is also known as Si3N4. It’s a key structural ceramic material that has high hardness and wear resistance.


Conductivity thermal of Silicon Nitride

The value is 17.4423.26W/m* (0 1,000). Furthermore, the material can withstand extreme cold temperatures up to 1000 degrees C, as well as sharp cooling, heating and subsequent cooling. It’s precise, because

silicon nitride ceramic

Because of their excellent properties, people use them often to create mechanical components like bearings, blades for air turbines, seals, or permanent molds. If

Si3n4 silicon nitride clay

These are highly resistant to heat and can not be easily transferred. It is possible to improve the heat-inspiration layer of the engine component, which not only increases the quality but also fuel efficiency.

Silicon nitride can be difficult to manufacture as bulk materials. It cannot be heated to more than 1850°C. This is due to the dissociation of silicon and nitrogen. It is therefore difficult to use hot press sintering. The temperature at which silicon nitride can be bonded to each other is lower. Alternatives include spark plasma sintering, which involves rapid heating (in seconds) using pulses or electric current to compact the powder. At temperatures of 1500 to 1700°C, this method has produced dense silicon nitride-compacts.

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Silicon Nitride Powder Si3N4 Product Characteristics:

Low density

The highest temperature strength

Superior resistance to thermal shock

Excellent wear resistance

High fracture resistance

Crescendo and mechanical fatigue

High oxidation resistance

Silicon Nitride Si3N4 powder Specification:

Product Name: Silicon Nitride

Purity: 99%

Particle Size: 0.5um-1um (a phase)

The Chemical Composition Of Silicon Nitride Si3N4 Puffer:

Si3N4 N O C Fe Al Ni Zn
>99% >38.9% 0.6-1.2 <0.2 <120ppm <3ppm <1ppm <1ppm


It is simple.


Silicon Nitride Si3N4 Powder produced?


It can perform direct silicon nitride or nitrogen extraction using the hexagonal bSi3N4. This can be done at a temperature of between 100 and 1400 C.

SiCL4 (L), 6 NH3(g) – SI (NH) 2 (+4 NH4Cl) (S), under conditions of zero degrees Celsius

3 Si (NH), 2 (S – Si3N4 [S] + N2(g) + 3H2 (g), at 1000 C

Or, you can use a Carbon Thermal Reduction reaction in a Nitro atmosphere at 1400-1450°C under a Nitro atmosphere.

3 SiO2(S)+ 6 C (+ 2 N2 [g] – Si3N4(S)+ 6 CO (6 CO (g)

But, silicon nitride made from impurity iron or silicate will be produced depending on the quality of the raw silicon materials. It is important to note that silicon nitride is not amorphous when it has been synthesized through diamine degradation. There is a commercial method of producing silicon nitride using the nitriding technique. Carbon-thermal reduction is the best way to create silicon nitride. This also makes it the most economically-friendly method of producing silicon powder in industry.

This is chemical vapor vapor or plasma enhanced chemical vapour deposition technique that creates the silicon nitride films at electron level.

3 SiH4 (G) + 4 NH3 (g) – Si3N4 (S) + 12 H2 (g)

3 SiCL4 / G + 4 NH3 g – SI3N4 (S) +12 HCl g

3 SiCL2H2 g + 4 NH3 g – SI3N4 s) + 6HCl g + 6 H2 g

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Silicium Nitride is used on semiconductor substrates

Two methods are available:

Horizontal or vertical tube furnaces can be performed at very high temperatures by using low pressure chemical vapor deposition methods.

Plasma enhanced chemicalvapor deposition methods are performed at relatively low temperatures and in vacuum.

Silicon nitride cell parameters are quite different to single-textile silicon. Thus, it is important to choose the right deposition technique so that the generated

silicon nitride film

Stress can cause tension and stress. Tension can be reduced when used with plasma-enhanced vapor deposition methods.

Silica was first prepared using soluble gel. Then, the silicon nanowires had to be treated with silicagel. Silica gel contains special carbon particles that are made of glucose at between 1200 and 1350°C.


Applicaciones


Silicon Nitride Si3N4 Powder:


Manufacturing structure: This could include metallurgy or machinery.

The surface treatment of metals or other materials, such as moulds, cutting tools and turbine blades.

Composits include metal, ceramic, graphite and graphite-composite, rubber and plastic

Mobile phones with transparent, colorless nanoparticles that self-lubricate wear membranes

Surface protection like that of a car

Jack joint;

Parts and ball valves

Corrosion-resistant turbine;

Metalurgical and chemical industries make components such as bearings/rollers, sleeves and valves.

Fabricating cutting tools, molds.

Fabrication of composite materials like ceramic, graphite and rubber as well as metal and adhesive.

Rocket, missile and nozzle spray pipes


Shipping and Packing of Silicon Nitride Si3N4 powder :

We offer many packing options, which depend on how large the amount of silicon nitride si3N4 powder is.

Packing of Silicon Nitride Si3N4 Powder: vacuum Packaging, 100g, 500g, 1kg/bag or 25kg/barrel. Or as requested.

Shipping Silicon Nitride Si3N4 powder: could ship out by sea or air as soon as payment receipt is received.

Luoyang Tongrun Nano Technology Co. Ltd.

Send us an inquiry if you’re looking for Si3N4 powder of high quality silicon nitride. (brad@ihpa.net)


Silicon Nitride Properties


Other Titles
Silicon (IV), nitride

12033-89-5

Compound Formula
Si3N4

Molecular Weight
140.28

Appearance
White Powder to Gray Powder

Melting Point
1900 degC

Boiling Point
N/A

Density
2.2-3.5 g/cm3

Solubility of H2O
Insoluble

Electrical Resistivity
11 to 12 10xO-m

Specific Heat
600 to 720 J/kg-K

Poisson’s Rate
0.24 to $0.27

Thermo Conductivity
12-31 W/m-K

Thermal Expansion
2.5 to 3.2 um/mK

Young’s Module
140 to 315 GPa

Exact mass
139.943 g/mol


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